High-speed semiconductor fuses, also known as fast blow fuses, are protective devices designed to safeguard semiconductor components (such as diodes, thyristors, IGBTs, etc.). Their key
characteristics primarily include melting speed, breaking capacity, overcurrent tolerance, and temperature performance, which will be detailed below
Electrical Performance Aspects
ast Fusing Speed, It can respond to short circuits or overcurrent faults within an extremely short time (typically in milliseconds or even microseconds) and melt, quickly cutting off the circuit. This
effectively protects semiconductor devices from damage caused by sudden high currents. For example, in semiconductor rectifier circuits, if a short circuit occurs, a high-speed semiconductor fuse
can melt within a few milliseconds, preventing components such as diodes from burning out due to overcurrent.
High Interrupting Capacity, It possesses a high short-circuit interrupting capability, enabling safe and reliable interruption of short-circuit currents reaching tens of kiloamperes or even higher,
without hazardous phenomena such as sustained arcing during the interruption process, ensuring circuit safety. For instance, in large power electronic converters, short-circuit currents may surge
to several tens of kiloamperes when a fault occurs, and high-speed semiconductor fuses can safely interrupt such high currents.
Overcurrent Withstanding Capacity Specificity, It has a specific time-current characteristic curve for different multiples of overcurrent. Under normal operating current, it can function stably and
reliably; when an overcurrent exceeding a certain multiple of the rated current occurs, it will quickly melt according to the preset time. For example, when the current is twice the rated current, it
may melt within seconds; when the current exceeds 10 times the rated current, it will melt within an extremely short millisecond-level time.
Physical Properties
Compact size, The design is compact and small in volume, making it suitable for installation in semiconductor equipment and circuit boards with high space requirements. This facilitates the
miniaturization and integration of equipment. For instance, in high-density power modules, high-speed semiconductor fuses can be conveniently installed in limited spaces.
Excellent Temperature Characteristics**: Its resistance value changes relatively little with temperature, maintaining stable electrical performance across different ambient temperatures. This
ensures reliable operation over a wide temperature range, making it suitable for various complex industrial and outdoor environments. For instance, it can function effectively in high-temperature
industrial workshops or cold outdoor power equipment, providing normal protective performance.
Other Aspects
Excellent Selectivity: In multi-stage protection circuits, high-speed semiconductor fuses can achieve good coordination with other protective devices (such as circuit breakers). When a fault occurs
in the circuit, only the fuse closest to the fault point will blow, without affecting other normal sections of the circuit, thereby enhancing power supply reliability and continuity.
High Reliability, Through stringent production processes and quality inspections, it boasts high reliability and stability. During long-term operation, it maintains consistent performance, reducing
equipment downtime and maintenance costs caused by fuse failures.
